Staff / Principal Advanced Packaging Engineer
Bitdeer Technologies Group is a technology company providing Bitcoin mining solutions, mining hardware, data-center infrastructure, and AI cloud services. It serves individual, institutional, and enterprise customers globally.
Funding history
Investors
Projects
About Bitdeer Technologies Group
Bitdeer provides vertically integrated Bitcoin mining and high-performance computing services. Its operations include mining equipment procurement and manufacturing, datacenter design and construction, equipment management, daily mining operations, cloud mining, and mining-related services. The company also offers AI cloud infrastructure and high-performance computing powered by NVIDIA GPUs for AI and machine-learning workloads, serving customers across global markets.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
This hands-on technical leadership role drives advanced packaging from concept through mass production, including chip-package-board co-design, substrate layout reviews, supplier management, signal and power integrity, thermal and mechanical reliability, manufacturing issue resolution, and product qualification.
Requirements
- Bachelor's degree or above in Microelectronics, Semiconductor Engineering, Electronic & Electrical Engineering, or a related discipline.
- 8+ years of experience in advanced semiconductor packaging, package architecture, design, or process engineering.
- Experience bringing complex semiconductor products from concept through high-volume production.
- Hands-on experience with high-layer-count FCBGA.
- Expert substrate layout review capability using Cadence APD, Allegro, or equivalent tools.
- Deep knowledge of signal and power integrity analysis for high-performance semiconductor devices and high-speed interfaces.
- Understanding of thermal and mechanical challenges, warpage mitigation, and stress management.
- Familiarity with JEDEC reliability standards and failure analysis techniques such as SAT, X-ray, FIB, and SEM.
- Excellent communication and cross-functional collaboration skills.
- Ability to manage and influence external vendors through technical leadership.
- Ability to lead complex packaging programs independently from development through production.
Responsibilities
- Define advanced packaging architecture and technology strategy.
- Evaluate PPAC trade-offs across packaging technologies.
- Lead chip-package-board co-design with silicon and hardware teams.
- Engage with stakeholders, packaging design houses, and substrate suppliers.
- Establish design rules, review processes, schedules, and quality standards.
- Review substrate layouts and DRC/DFM compliance.
- Assess supplier capabilities and technology roadmaps.
- Lead signal and power integrity reviews for high-speed interfaces.
- Validate electromagnetic simulation results.
- Drive thermal architecture and mechanical reliability strategies.
- Oversee warpage, stress, thermal, and reliability modelling.
- Lead packaging execution from NPI through high-volume manufacturing.
- Resolve bumping, assembly, molding, and package integration issues.
- Improve yield and resolve solder, bonding, and reliability issues.
- Define reliability qualification strategies and lead failure analysis.
Benefits
- Authentic and diverse workplace culture.
- Inclusive environment with open workspaces and startup spirit.
- Networking opportunities with industrial pioneers and enthusiasts.
- Opportunity to contribute directly to the digital asset industry.
- Involvement in new projects and process development.
- Personal accountability, autonomy, fast growth, and learning opportunities.
- Welfare benefits, training, and mentoring.