Senior Advanced Packaging and Power Delivery Engineer
European AI-semiconductor company building AI inference accelerators and software for embedded, edge, server, and data-center deployments.
Funding history
About Axelera AI
Axelera AI develops purpose-built AI acceleration hardware and the Voyager SDK for computer-vision, generative-AI, and other inference workloads, emphasizing power- and thermally-constrained deployments.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You will own end-to-end power-delivery design, from on-die grids through package and PCB PDN analysis. You will lead advanced packaging architecture for multi-chiplet and 3D-integrated systems, perform SI/PI verification, support thermal reviews, develop design methodologies, and work with external packaging partners.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field
- 7+ years of experience in power delivery or advanced packaging design
- Expertise in on-die power-grid design and package/PCB PDN analysis
- Experience with 2.5D or 3D IC packaging, multi-chiplet integration, and interposer/substrate co-design
- Proficiency with EDA tools for power integrity, PDN simulation, and package design
- Ability to work cross-functionally and communicate technical trade-offs
- Written and spoken English communication skills
Responsibilities
- Own end-to-end power-delivery design from on-die grids through package and PCB PDN analysis
- Lead advanced packaging architecture for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design
- Perform SI/PI verification and sign-off across the full stack
- Align power-delivery and packaging solutions with product and silicon requirements
- Support thermal and integration reviews
- Develop and maintain power-delivery methodologies, flows, and design guidelines
- Identify and mitigate single-point-of-failure risks and mentor packaging expertise
- Engage external partners, substrate and interposer vendors, and OSAT houses
Benefits
- Pension plan
- Employee insurances
- Company shares