Advanced Packaging SI/PI Engineer
Etched is an AI-hardware company building rack-scale frontier inference clusters.
Funding history
About Etched
Etched co-designs chips, racks, software, and manufacturing systems for efficient inference of frontier AI models, targeting throughput, latency, cost, and power efficiency across prefill and decode workloads.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You will own the electrical performance of AI accelerator platforms across silicon, packages, and boards. You will perform signal- and power-integrity analysis, drive package and interposer requirements, define power-delivery and decoupling strategies, and support board- and rack-level studies. You will work through design reviews and partner with layout, ASIC, and system stakeholders from early design through tape-out and validation.
Requirements
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field
- 8+ years of signal-integrity and power-integrity experience on high-performance ASIC, processor, or accelerator platforms
- Experience defining and closing power-delivery networks for high-power silicon
- Experience with HBM, SerDes, and D2D high-speed interfaces
- Expertise with ANSYS HFSS, SIwave, Cadence Sigrity, or Keysight ADS
- Experience with CoWoS or equivalent advanced packaging technologies
- Experience correlating signal-integrity and power-integrity test vehicles with silicon measurements
- Analytical and communication skills
Responsibilities
- Analyze and optimize signal integrity and power integrity in 2D, 2.5D, and 3D packages
- Collaborate with package, ASIC, and board design stakeholders to optimize electrical performance
- Drive high-speed routing requirements into interposer and substrate layouts through tape-out
- Own power-delivery-network design, decoupling strategy, and IR-drop and impedance targets
- Own ball-map, C4, and BGA pin assignments through final freeze
- Support board-level and rack-level signal- and power-integrity studies, test-vehicle design, and cable characterization
- Participate in cross-functional meetings and design reviews
Benefits
- Medical, dental, and vision coverage with generous premium coverage
- USD 500 monthly credit for waiving medical benefits
- USD 2.5k monthly housing subsidy for eligible nearby residents
- Relocation support to San Jose
- Wellness benefits covering fitness and mental health
- Daily office lunch and dinner
- Unlimited compute budget subject to ROI justification