Lead Systems Signal Integrity Power Integrity Engineer
Cerebras builds wafer-scale AI computing systems and a cloud inference platform for training, fine-tuning, and serving AI models.
About Cerebras Systems, Inc.
Cerebras Systems is an AI-infrastructure company founded in 2015. It sells rack-scale wafer-scale computing systems and provides cloud-based, API-accessible AI inference alongside on-premises deployments.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You will perform pre-layout and post-layout signal and power integrity analysis across PCBs, flex circuits, connectors, and advanced packages. You will lead root-cause investigations, troubleshoot power-delivery networks, refine stack-ups, review designs, and recommend targeted fixes for complex system-level integrity issues.
Requirements
- Master’s degree in Electrical Engineering
- 15+ years of system-level signal integrity and power integrity engineering experience for high-speed hardware systems
- Expertise in high-speed serial and parallel interface analysis and debugging
- Experience with PCB, rigid-flex, and flex-circuit stack-up design and analysis
- SI/PI analysis experience with flex connectors, high-density interconnects, and advanced packaging
- Proficiency with 2D and 3D electromagnetic simulation tools
- Power-delivery network analysis, simulation, and lab correlation experience
- Knowledge of transmission-line theory, microwave engineering, and high-speed design fundamentals
- Ability to correlate simulation results with hardware behavior and drive design fixes
- Experience working on server hardware, AI accelerators, hardware accelerators, datacenters, AI hardware, enterprise products, GPUs, CPUs, TPUs, or server platforms
Responsibilities
- Solve signal integrity and power integrity problems for high-speed AI compute platforms
- Perform pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, connectors, and packages
- Lead root-cause analysis for margin shortfalls, impedance discontinuities, coupling, resonances, and simulation-to-hardware mismatches
- Analyze flex circuits, flex connectors, interposers, and advanced packaging technologies
- Analyze and troubleshoot power-delivery networks with DC and AC simulations and hardware correlation
- Define PCB, rigid-flex, and flex-circuit stack-ups, materials, and impedance structures
- Review schematics, PCB layouts, and flex designs and recommend design changes
- Collaborate with silicon and package teams on interface integrity issues
- Act as a technical escalation point for complex SI/PI issues