Advanced Packaging Reliability Engineer

Skills

About the Role

You will lead reliability engineering for advanced AI and high-performance computing packages. You will assess mechanical and thermal risks, apply thermo-mechanical models, develop test and qualification plans, investigate failures, and recommend corrective actions from early architecture through high-volume manufacturing.

Requirements

• 8+ years of industry experience in semiconductor package reliability
• Knowledge of package reliability principles and failure mechanisms
• Knowledge of advanced packaging architectures including 2.5D and 3.5D integration, chiplets, HBM, and redistribution layers
• Experience leading package failure investigations and corrective actions
• Experience with thermal and mechanical finite-element modeling
• Understanding of package-material behavior

Responsibilities

• Lead reliability test planning and assessments for advanced HPC packages
• Identify risks, analyze failure mechanisms, investigate root causes, and develop corrective actions
• Optimize package designs using thermo-mechanical modeling
• Develop, validate, and apply reliability models and lifetime-prediction methodologies
• Evaluate package architectures, materials, structural designs, and assembly processes
• Predict electromigration lifetime for package interconnects

Benefits

• Medical, dental, and vision insurance with employer Health Savings Account contributions
• Pre-tax health, dependent-care, parking, and transit accounts
• 401(k) retirement plan with employer match
• Paid parental, medical, and caregiver leave
• Flexible PTO or up to 15 days of annual PTO depending on employee classification
• Paid holidays, company office closures, and sick or safe time
• Mental health and wellness support
• Employer-paid basic life and disability coverage
• Daily office meals and eligible meal-delivery credits
• Relocation support for eligible employees
• Charitable donation matching and wellness stipends may be provided