Staff Engineer, Mechanical Design
TenstorrentVisit Tenstorrent website
Tenstorrent is an AI-computing company that sells AI hardware and licenses AI and RISC-V intellectual property.
Series ERecently funded364 current maintainers296 active leads42 new active leads111 lead step-downs8 early lead departures
Toronto, Canada
Funding history
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About Tenstorrent
Tenstorrent builds computers for AI, including AI processors, scalable server systems, and open-source software and compiler tooling. It also licenses AI and RISC-V IP for customers building customized silicon.
Skills
Candidate Availability
About the Role
You will lead mechanical and thermal design for next-generation multi-chip AI servers and advanced data center hardware. You will architect dense server chassis and rack integration, lead structural and reliability analysis, drive DFM and DFA with ODMs and suppliers, and own technical execution across the product lifecycle while mentoring other engineers. Some international travel is expected.
Requirements
- Bachelor's or master's degree in Mechanical Engineering or related field
- 10+ years designing enterprise servers, HPC systems or specialized AI hardware
- Experience architecting high-density server enclosures and rack-level systems (1U–4U, OCP, EIA) with air cooling, cold plates and liquid cooling
- Proficiency in 3D CAD, preferably SolidWorks, and large-assembly management
- Experience in sheet metal, complex surfacing, routing and wire harness design
- Knowledge of high-volume manufacturing (stamping, die casting, extrusion, injection molding), rapid prototyping, GD&T and tolerance stack-up analysis
- Ability to travel internationally up to 10–15%
- Eligibility to access U.S. export-controlled technology
Responsibilities
- Architect mechanical and thermal design strategies for high-power AI compute systems including multi-chip server chassis, rack integration and PCIe accelerators
- Define board layouts, power constraints and thermal envelopes with electrical, thermal, SI/PI and system architecture teams
- Lead structural and reliability analysis including FEA, PCB microstrain validation, and shock and vibration assessment
- Define product-level testing for vibration, shock, thermal cycling and environmental conditions
- Evaluate and introduce mechanical and thermal technologies meeting data center and regulatory standards
- Define and drive DFM and DFA strategies with ODMs, contract manufacturers, suppliers, tooling vendors and test labs
- Manage system BOMs in PLM and lead supplier and manufacturing readiness
- Conduct design reviews, establish engineering best practices and mentor junior and mid-level engineers