Silicon Packaging Engineer Intern and New Graduate

Skills

About the Role

You will work on real silicon packaging challenges for photonic products. Depending on your background, you will contribute to high-speed interfaces, thermal analysis, mechanical and thermo-mechanical design, or packaging integration and reliability.

Requirements

• Pursue or recently complete a BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field
• Have hands-on experience through coursework, capstone projects, research labs, or internships
• Be familiar with at least one relevant tool such as SolidWorks, ANSYS, ADS, Cadence, Python, or MATLAB
• Have the capacity to comply with federally mandated U.S. export control requirements

Responsibilities

• Contribute to signal and power integrity analysis, PDN design, and simulation
• Perform thermal engineering analysis, including CFD simulation and cooling evaluation
• Support mechanical and thermo-mechanical design, structural analysis, and tolerance stack-up
• Contribute to 2.5D and 3D packaging, fiber attach, heterogeneous integration, yield, and reliability

Benefits

• Comprehensive health care plan including medical, dental, and vision coverage
• Retirement savings matching program
• Life insurance including basic, voluntary, and AD&D coverage
• Generous time off including vacation, sick time, and public holidays
• Paid family leave
• Short-term and long-term disability coverage
• Commuter benefits
• Flexible hybrid workplace model
• Equity grants for eligible full-time employees