Rack Interconnect Engineer
FuriosaAI is a South Korean AI semiconductor company building energy-efficient inference accelerators, servers, and software for enterprise and cloud AI deployments.
Funding history
Investors
About FuriosaAI
FuriosaAI develops the RNGD AI inference accelerator and NXT RNGD Server, alongside a software toolchain for compiling, optimizing, and deploying LLM and agentic-AI workloads.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You will own the physical implementation of high-speed rack interconnects, including cables, connectors, backplanes, routing, serviceability, and high-density integration. You will define architecture and requirements, evaluate interconnect technologies and vendors, resolve mechanical conflicts, and support manufacturing partners.
Requirements
- Extensive experience with high-speed physical interconnect systems
- Strong understanding of high-speed cables, connectors, backplanes, and physical channel design
- Experience with high-density server, data center, or networking systems
- Understanding of signal integrity considerations
- Experience working with connector and cable vendors and external design partners
- Experience taking complex interconnect systems through manufacturing
- Excellent English communication skills
Responsibilities
- Define physical interconnect architecture for high-density rack systems
- Define cable, connector, and backplane strategies
- Evaluate DAC, AEC, AOC, and emerging interconnect technologies
- Drive trade-offs among near-package copper, co-packaged copper, and co-packaged optics
- Define connector density, reach, routing, and serviceability requirements
- Develop removable cable and backplane architectures for field service
- Define physical channel allocation and routing strategies
- Resolve mechanical conflicts among cables, connectors, cooling components, and power distribution
- Coordinate interconnect requirements with system, mechanical, thermal, power, and SI/PI teams
- Define DFM/DFA requirements for cable and connector assembly
- Evaluate vendors and direct external design partners and CM/ODM teams