Principal Packaging Engineer
Velaura AI develops ultra-low-power compute technology for cloud, edge, and physical AI applications. It also offers Teraflux Bitcoin mining hardware, fleet-management software, and related support for mining operators.
Maintainer signals as of 8/14/2026
Funding history
About Velaura AI
Velaura AI is a semiconductor and technology company that provides patented ultra-low-power silicon design technology, IP, toolflows, and custom chiplet solutions for AI compute platforms. Its customers include hyperscaler and XPU companies seeking reduced power consumption and higher compute efficiency. The company also builds Teraflux Bitcoin mining products, including air-, hydro-, and immersion-cooled miners, ASICs, modular containers, miner firmware, fleet-management software, and enterprise customer support.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You own package architecture and development for next-generation SoCs from concept through production. You co-optimize package, die, board, and system designs, select packaging technologies, lead package design and assembly interactions, manage signal and power integrity, and collaborate on thermal, mechanical, reliability, manufacturing, foundry, and test requirements.
Requirements
- Deep experience developing advanced semiconductor packages for high-performance SoCs
- Strong understanding of package architecture, substrate technologies, bumping, assembly flows, and manufacturing
- Experience co-optimizing package design with silicon, board, signal integrity, power integrity, thermal, and mechanical teams
- Hands-on experience with signal integrity, power integrity, thermal, and reliability considerations
- Ability to balance technical performance with cost, yield, manufacturability, and schedule
- Experience with chiplets, 2.5D integration, silicon bridges, or heterogeneous integration
- Experience with HBM integration and high-bandwidth memory package architecture
- Experience with advanced process nodes
- Experience working with foundries, OSATs, and substrate vendors
- Experience in an early-stage semiconductor company
Responsibilities
- Own package architecture from concept through production
- Co-optimize package, die, board, and system design for performance, power, cost, and manufacturability
- Drive package technology selection
- Lead package design, bump planning, substrate definition, escape routing, and assembly interactions
- Own package-level signal integrity and power integrity planning
- Collaborate on thermal architecture, mechanical integration, reliability, DFM, and qualification
- Work with foundry, assembly, substrate, and test partners to deliver products to production
- Define the long-term packaging roadmap
Benefits
- Performance-based incentives
- Equity participation
- Medical coverage
- Dental coverage
- Vision coverage
- Paid time off
- Flexible work arrangements
- Professional development opportunities