Package Layout Engineer

Skills

About the Role

You will deliver IC package substrate layouts for standard and advanced packaging technologies. You will create preliminary designs and floorplans, work with substrate suppliers and OSATs, generate fabrication files, and ensure designs meet signal integrity, power integrity, thermal, mechanical, and manufacturing requirements. You will also support tape-outs, iterative routing studies, design automation, and verification.

Requirements

• B.S. or M.S. degree in Electrical Engineering or a similar discipline
• At least 5 years of relevant experience
• 3–5 years of IC package layout design experience
• Proficiency with Allegro X APD
• Understanding of IC package substrates and organic materials

Responsibilities

• Deliver IC package substrate layouts for standard and advanced packaging technologies
• Create preliminary substrate designs and floorplans to support stack-up optimization
• Collaborate with substrate suppliers and OSAT companies on design rules and implementation guidelines
• Generate fabrication files and coordinate design-for-manufacturing and design-for-assembly closure
• Design packages that meet signal integrity, power integrity, thermal, and mechanical requirements
• Support signal and power integrity engineers with iterative test routes
• Coordinate error-free package design tape-outs on schedule
• Support design automation and verification activities

Benefits

• Medical, dental, and vision coverage
• Retirement savings matching program
• Life insurance
• Vacation, sick time, and public holidays
• Paid family leave
• Short-term and long-term disability coverage
• Commuter benefits
• Flexible hybrid workplace model
• Equity grants for applicable full-time employees