Packaging Architect

Skills

About the Role

You will develop advanced packaging solutions from concept through product release. You will evaluate architecture trade-offs, define electrical, thermal, and mechanical specifications, work with supply chain and quality teams, and engage product teams and customers to shape packaging roadmaps. You will balance performance, cost, manufacturability, budget, and schedule constraints.

Requirements

• Ph.D. or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field
• 15+ years of experience in advanced 2D/3D packaging technologies
• 10+ years of expertise in power or signal integrity, thermal-mechanical analysis, or optical packaging
• Experience performing system-level trade-offs across silicon, package, and board
• Experience with SERDES, PCIe, and die-to-die interconnects
• Track record of delivering packages and products through production release
• Proficiency with industry-standard EDA and CAD tools

Responsibilities

• Evaluate trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies
• Define packaging specifications for electrical, thermal, and mechanical performance
• Determine package architecture across silicon, package, and system constraints
• Define technology and material requirements with supply chain engineering
• Collaborate on packaging qualification criteria and issue resolution
• Engage product teams and customers on emerging packaging architectures
• Monitor competitive packaging technologies to inform technical decisions

Benefits

• Medical, dental, and vision coverage
• Retirement savings matching program
• Life insurance
• Vacation, sick time, and public holidays
• Paid family leave
• Short-term and long-term disability coverage
• Commuter benefits
• Flexible hybrid workplace model
• Equity grants for applicable full-time employees