Manufacturing Engineer Packaging and OSAT
Tenstorrent is an AI-computing company that sells AI hardware and licenses AI and RISC-V intellectual property.
Funding history
Investors
About Tenstorrent
Tenstorrent builds computers for AI, including AI processors, scalable server systems, and open-source software and compiler tooling. It also licenses AI and RISC-V IP for customers building customized silicon.
Skills
Candidate Availability
Required and preferred rules are kept separate and reflect the wording in the original posting.
About the Role
You will translate package requirements into executable assembly flows, specifications, control plans, inspection requirements, and manufacturing documentation. You will lead factory commissioning, qualification, pilot builds, reliability activities, production-readiness reviews, and partner audits. You will improve process capability, yield, quality, and delivery performance while resolving technical issues and implementing controlled changes.
Requirements
- 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a related environment
- Experience with semiconductor assembly, package manufacturing, package test, board assembly, or final product manufacturing
- Experience working with OSATs, substrate suppliers, bumping suppliers, test houses, and contract manufacturers
- Ability to interpret package drawings, BGA maps, BOMs, PCB data, process reports, quality reports, reliability results, and manufacturing documentation
Responsibilities
- Translate package requirements into assembly process flows, manufacturing specifications, control plans, and documentation
- Lead factory commissioning, line bring-up, pilot builds, qualification lots, reliability activities, and production-readiness reviews
- Establish and improve process capability, yield, quality, test, cycle-time, and delivery targets
- Use SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving to improve manufacturing results
- Resolve technical issues and implement controlled changes across silicon, package, assembly, test, and factory operations